IP Library › Assignment 047942/0453
Patent Assignment
Reel/Frame 047942/0453

Assignment of Assignor's Interest

Recorded: 2019-01-09 Pages: 4
Assignors
LIN, YUSHENG
Executed: 2019-01-09
TEYSSEYRE, JEROME
Executed: 2019-01-08
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
High Power Module Package Structures
Application: 16/243,505 →
Publication: US 2019/0341332
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jun 14, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 049473/0932 →
Release of Security Interest in Patents Previously Recorded at Reel 049473, Frame 0932 Aug 17, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064618/0721 →