Patent Assignment
Reel/Frame 049473/0932
Security Interest
Recorded: 2019-06-14
Pages: 17
Assignors
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Executed: 2019-04-22
FAIRCHILD SEMICONDUCTOR CORPORATION
Executed: 2019-04-22
Assignee
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
60 WALL STREET, NEW YORK, NEW YORK, 10005
Covered Properties
(120)
Electronic Device Including a HEMT Including a Buried Region
Application:
16/241,172 →
Publication:
US US20200219871A1
Isolation Structure for Semiconductor Device Having Self-Biasing Buried Layer and Method Therefor
Double-Integrated Silicon Control Rectifier Transistor and Related Methods
Zener Diodes and Methods of Manufacture
Application:
16/249,553 →
Publication:
US US20200227402A1
Termination Implant Enrichment for Shielded Gate Mosfets
Superjunction Semiconductor Device and Method of Manufacturing the Same
Electronic Device Including an Enhancement-Mode HEMT and a Method of Using the Same
Method of Separating a Back Layer on a Singulated Semiconductor Wafer Attached to Carrier Substrates
Semiconductor Device Having Biasing Structure for Self-Isolating Buried Layer and Method Therefor
Integrated Isolation Capacitance Structure
Patent:
10,629,474 →
Application:
16/249,676 →
Super-Junction Mosfet with Integrated Snubber Circuit
Application:
62/799,158 →
Schottky Rectifier with Surge-Current Ruggedness
Application:
62/804,559 →
Method of Forming a Semiconductor Device and Structure Therefor
Application:
62/807,283 →
Method of Forming a Semiconductor Device and Structure Therefor
Application:
62/807,293 →
Electronic Device Including a Semiconductor Body or an Isolation Structure Within a Trench
Application:
62/817,903 →
Insulated Gated Field Effect Transistor Structure Having Shielded Source and Method
Application:
62/818,178 →
Safe Operating Area Improvement in Power Devices and Related Methods
Application:
62/818,212 →
Power Conversion Using Artificial Intelligence
Application:
62/823,441 →
Plasma Die Singulation Systems and Related Methods
High Power Module Package Structures
Flexible Press Fit Pins for Semiconductor Packages and Related Methods
Backside Metal Formation Methods and Systems
Recessed Lead Leadframe Packages
Vertical and Horizontal Circuit Assemblies
Wafer Level Flat No-Lead Semiconductor Packages and Methods of Manufacture
Wafer Level Flat No-Lead Semiconductor Packages and Methods of Manufacture
Wafer Level Flat No-Lead Semiconductor Packages and Methods of Manufacture
Polymer Resin and Compression Mold Chip Scale Package
Backside Metal Removal Die Singulation Systems and Related Methods
Application:
62/796,630 →
Partial Backside Metal Removal Singulation System and Related Methods
Application:
62/796,645 →
Backside Metal Patterning Die Singulation Systems and Related Methods
Application:
62/796,651 →
Backside Metal Patterning Die Singulation System and Related Methods
Application:
62/796,659 →
Backside Metal Patterning Die Singulation Systems and Related Methods
Application:
62/796,668 →
Backside Metal Photolithographic Patterning Die Singulation Systems and Related Methods
Application:
62/796,671 →
Substrate Alignment Systems and Related Methods
Application:
62/796,675 →
Backside Wafer Alignment Methods
Application:
62/796,680 →
Methods of Aligning a Semiconductor Wafer for Singulation
Application:
62/796,687 →
Power Semiconductor Device Package
Application:
62/803,709 →
Semiconductor Package with Heatsink
Application:
62/811,147 →
Semiconductor Package and Related Methods
Application:
62/814,366 →
Fan-Out Wafer Level Chip-Scale Packages and Methods of Manufacture
Application:
62/820,985 →
Leadframe Systems and Related Methods
Application:
62/823,773 →
Image Sensor Package Having a Light Blocking Member
Application:
62/825,529 →
Ignition Control System with Circulating-Current Control
Detection of Noise-Induced Ultrasonic Sensor Blindness
Method for Acoustic Distance Time of Flight Compensation
Slave Device Enhancing Data Rate of DSI3 Bus
Track and Hold System
Application:
62/806,446 →
Bidirectional Leakage Compensation
Application:
62/806,465 →
Chopping Technique to Reduce Kick-Back Disturbance
Application:
62/806,524 →
Threshold-Less Ultrasonic Park-Assist-Sensor System
Application:
62/808,947 →
System and Method for Bidirectional Current Sense Circuits
Diode Circuit for Efficient Operation
Application:
16/263,659 →
Publication:
US US20190296737A1
Method of Forming a Semiconductor Device
Application:
62/796,663 →
Internal Power Supply for Amplifiers
Application:
62/800,633 →
System and Method for Controlling a Low-Dropout Regulator
Application:
62/815,114 →
Digital Buffer Circuit
Application:
62/820,954 →
Transistor Device Having a Source Region Segments and Body Region Segments
Application:
62/826,736 →
Local Pixel Driver Circuitry
Rotor Position Sensing System for Three Phase Motors and Related Methods
Methods and Apparatus for a Power Management Unit
Methods of Forming Capacitors
Image Sensors Having Imaging Pixels with Ring-Shaped Gates
Image Sensors with Diffractive Lenses in a Semiconductor Substrate
Application:
16/245,965 →
Publication:
US US20200227458A1
Methods and Apparatus for a Capacitive Sensor
Methods and System for a Capacitive Touch Sensor
Methods and Apparatus for Reducing Spatial Flicker Artifacts
Controlling Multiple Facets of Duty Cycle Response Using a Single Motor Integrated Circuit Pin
Image Sensor Packages Formed Using Temporary Protection Layers and Related Methods
Image Sensor Packages Formed Using Temporary Protection Layers and Related Methods
Application:
16/282,547 →
Publication:
US US20190189663A1
Methods and Apparatus for an Interface
Methods and Apparatus for a Capacitive Pressure Sensor
Methods and Apparatus for a Processing Circuit
Die Stacked Image Sensors and Related Methods
Image Sensors with Diffractive Lenses
Imaging Systems with Sub-Radix-2 Charge Sharing Successive Approximation Register (Sar) Analog-to-Digital Converters
Patent:
10,432,211 →
Application:
16/361,602 →
Battery Management System for Gauging with Low Power
Method of Forming a Semiconductor Device
Application:
62/791,961 →
Apparatus and Methods for Code Patching
Application:
62/794,299 →
Methods and Apparatus for a Touch Sensor
Application:
62/796,906 →
Backside Illuminated Image Sensors with Pixels That Have High Dynamic Range, Dynamic Charge Overflow, and Global Shutter Scanning
Application:
62/797,621 →
Pixel Control Signal Verification in a Stacked Image Sensor
Application:
62/799,802 →
Image Sensors with Reduced Noise
Application:
62/799,988 →
Apparatus and Methods for Single Photon Avalanche Diode
Application:
62/800,840 →
Imaging Systems with Weathering Detection Pixels
Application:
62/809,253 →
Image Sensor Devices and Related Methods
Application:
62/810,370 →
Methods and Apparatus for a Capacitive Sensor
Application:
62/811,178 →
Image Sensor with Near-Infrared and Visible Light Phase Detection Pixels
Application:
62/811,376 →
Memory Device and Data Verification Method
Application:
62/814,329 →
Image Sensors with High Dynamic Range and Flicker Mitigation
Application:
62/815,026 →
Semiconductor Device with Single-Photon Avalanche Diode Pixels and a Light Attenuating Layer
Application:
62/815,040 →
High Resolution Mimo Radar Transmitter Architecture
Application:
62/817,030 →
Envelope-Modulated Fm-Cw Radar Transmitter
Application:
62/817,035 →
Radar Sub-Cube Transmission
Application:
62/817,099 →
Methods and Apparatus for an Analog-to-Digital Converter
Application:
62/817,837 →
Microlenses for Semiconductor Device with Single-Photon Avalanche Diode Pixels
Application:
62/817,954 →
Imaging Systems and Methods for Generating Color Information and Pulsed Light Information
Application:
62/819,081 →
Touch Sensor Systems and Methods
Application:
62/819,308 →
Methods and Apparatus for a Capacitive Sensor
Application:
62/822,190 →
Methods and Apparatus for a Capacitive Sensor
Application:
62/825,465 →
Switch Control Circuit Including Multipin to Set Dead Time Information and/or Protection Mode
Synchronous Rectifier Control for Switched Mode Power Supplies and Method Therefor
Patent:
10,615,700 →
Application:
16/252,836 →
Methods and Systems of Driving Arrays of Diodes
Sensing Resistor Short Determiner, Switch Control Circuit Including the Same and Power Supply Including the Switch Control Circuit
Application:
16/266,194 →
Publication:
US US20190170803A1
Semiconductor Device and Method Therefor
Signal Receiving Circuit and Method, and Signal Detecting Circuit
Multi-Phase Control for Pulse Width Modulation Power Converters
Control Circuit and Method Therefor
Signal Calculator
Power Supply with Near Valley Switching in Near Valley Window Time Period
Output Driver Having Pull-Down Capability
Switch Device with Switch Circuits That Provide High Voltage Surge Protection
Switch Control Circuit and Buck Converter Comprising the Same
Methods and Systems of Bridgeless Pfc Converters
Low Loss Ic Self Supply
Methods and Systems of Operating Power Converters
Application:
62/796,665 →
Controller for Closed Loop Control of a Dcx Converter and Method Therefor
Application:
62/817,390 →
Methods and Systems of Operating Dc to Dc Power Converters
Application:
62/824,841 →
Deep Dimming for Led Drivers
Application:
62/825,165 →
Apparatus and Method for Restarting an Electronic Device
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 7, 2019
From: MOENS, PETER; BANERJEE, ABHISHEK; VANMEERBEEK, PIET; DECLERCQ, FREDERICK JOHAN G
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047918/0964 →
Assignment of Assignor's Interest
Jan 9, 2019
From: SEDDON, MICHAEL J.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047941/0041 →
Assignment of Assignor's Interest
Jan 9, 2019
From: LIN, YUSHENG; TEYSSEYRE, JEROME
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047942/0453 →
Assignment of Assignor's Interest
Jan 10, 2019
From: AGAM, MOSHE; JANSSENS, JOHAN CAMIEL JULIA; PJENCAK, JAROSLAV; YAO, THIERRY
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047959/0159 →
Assignment of Assignor's Interest
Jan 11, 2019
From: GRISWOLD, MARK; ELHAMI KHORASANI, ARASH
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 047970/0103 →
Assignment of Assignor's Interest
Jan 16, 2019
From: YAO, YUSHUANG; CHEW, CHEE HIONG; PRAJUCKAMOL, ATAPOL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 048035/0382 →
Assignment of Assignor's Interest
Jan 16, 2019
From: SABUI, GOURAB; CHEN, YUPENG; SHARMA, UMESH
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 048036/0434 →
Assignment of Assignor's Interest
Jan 16, 2019
From: HU, YONGZHONG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 048037/0250 →
Assignment of Assignor's Interest
Jan 23, 2019
From: SEDDON, MICHAEL J.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 048107/0482 →
Assignment of Assignor's Interest
Jan 25, 2019
From: YEDINAK, JOSEPH; WU, XIAOLI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 048139/0001 →
Assignment of Assignor's Interest
Feb 6, 2019
From: LEE, KWANG-WON; KANG, HYE-MIN; LEE, JAE-GIL
To: FAIRCHILD KOREA SEMICONDUCTOR LTD.
Reel/Frame 048253/0634 →
Assignment of Assignor's Interest
Feb 6, 2019
From: FAIRCHILD KOREA SEMICONDUCTOR LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 048274/0711 →
Assignment of Assignor's Interest
Feb 7, 2019
From: RICODEAU, FRANCOIS
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 048266/0252 →
Assignment of Assignor's Interest
Feb 28, 2019
From: JEON, WOOCHUL; PADMANABHAN, BALAJI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 048462/0728 →
Assignment of Assignor's Interest
Mar 13, 2019
From: GRIVNA, GORDON M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 048587/0410 →
Assignment of Assignor's Interest
Mar 14, 2019
From: AGAM, MOSHE; JANSSENS, JOHAN CAMIEL JULIA; GREENWOOD, BRUCE; HOSE, SALLIE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 048601/0198 →
Release of Security Interest in Patents Previously Recorded at Reel 049473, Frame 0932
Aug 17, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064618/0721 →