Patent Assignment
Reel/Frame 048587/0410
Assignment of Assignor's Interest
Recorded: 2019-03-13
Pages: 3
Assignor
GRIVNA, GORDON M.
Executed: 2013-10-18
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Method of Separating a Back Layer on a Singulated Semiconductor Wafer Attached to Carrier Substrates
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 14, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 049473/0932 →
Release of Security Interest in Patents Previously Recorded at Reel 049473, Frame 0932
Aug 17, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064618/0721 →