Plasma die singulation systems and related methods
Implementations of methods of singulating a plurality of die included in a substrate may include exposing a substrate material of a substrate in a die street through removing a metal layer in the die street coupled to the substrate, wherein only a portion of the substrate material in the die street is removed, and singulating a plurality of die included in the substrate through plasma etching the exposed substrate material of the substrate in the die street.
1. A method of singulating a plurality of die comprised in a substrate, the method comprising:
exposing a substrate material of a substrate in a die street through removing a metal layer in the die street coupled to the substrate, wherein only a portion of the substrate material in the die street is removed; and
singulating a plurality of die comprised in the substrate through plasma etching the exposed substrate material of the substrate in the die street;
wherein the substrate is less than 50 micrometers thick;
wherein the portion of the substrate material in the die street and the metal layer are removed substantially simultaneously; and
wherein the portion of the substrate material removed extends between 5 to 15 micrometers into the substrate.
2. The method of claim 1 , wherein the substrate is less than 30 micrometers thick.
3. The method of claim 1 , wherein removing the metal layer in the die street further comprises removing through one of sawing, lasering, scribing, or jet ablating.
4. The method of claim 1 , further comprising removing damage from a sidewall of the die street through the plasma etching.
5. The method of claim 1 , wherein exposing the substrate further comprises removing a passivation layer coupled over the metal layer.
6. The method of claim 1 , wherein singulating the plurality of die comprised in the substrate through plasma etching further comprises removing a portion of the substrate material of the substrate having a width less than a width of the die street.
7. A method of singulating a plurality of die comprised in a substrate, the method comprising:
exposing a substrate material of a substrate in a die street through removing a passivation layer in the die street coupled to the substrate, wherein only a portion of the substrate material in the die street is removed; and
singulating a plurality of die comprised in the substrate through plasma etching the exposed substrate material of the substrate in the die street;
wherein the substrate is less than 50 micrometers thick;
wherein the portion of the substrate material in the die street, the passivation layer, and a metal layer are removed substantially simultaneously; and
wherein the portion of the substrate material removed extends between 5 to 15 micrometers into the substrate.
8. The method of claim 7 , wherein removing a metal layer in the die street further comprises removing through one of sawing, lasering, scribing, or jet ablating.
9. The method of claim 7 , further comprising removing damage from a sidewall of the die street through the plasma etching.
10. A method of singulating a plurality of die comprised in a substrate, the method comprising:
exposing a substrate material of a substrate in a die street through removing a passivation layer and a metal layer in the die street coupled to the substrate, wherein only a portion of the substrate material in the die street is removed; and
singulating a plurality of die comprised in the substrate through plasma etching the exposed substrate material of the substrate in the die street;
wherein the substrate is less than 50 micrometers thick;
wherein the portion of the substrate material in the die street, the passivation layer, and the metal layer are removed substantially simultaneously; and
wherein the portion of the substrate material removed extends between 5 to 15 micrometers into the substrate.
11. The method of claim 10 , wherein removing the passivation layer and the metal layer in the die street further comprises removing through one of sawing, lasering, scribing, or jet ablating.
12. The method of claim 10 , wherein singulating the plurality of die comprised in the substrate through plasma etching further comprises removing a portion of the substrate material of the substrate having a width less than a width of the die street.
13. The method of claim 10 , further comprising removing damage from a sidewall of the die street through the plasma etching.
14. The method of claim 10 , wherein the substrate is less than 30 micrometers thick.