Polymer resin and compression mold chip scale package
A method for fabricating a chip scale package, comprising: providing a wafer; applying a polymer resin on at least part of a first surface of the wafer and to one or more sides of the wafer; and applying a compression mold on at least part of a second surface of the wafer and to one or more sides of the wafer, said first and second surfaces opposing each other.
1. A chip scale package, comprising:
a die;
a first mold compound contacting a first surface of the die and one or more sidewalls of the die;
a metallization layer coupled on the first surface of the die;
a plurality of solder units coupled on the metallization layer; and
a second mold compound contacting a second surface of the die and one or more sidewalls of the die;
wherein the first mold compound contacts the second mold compound.
2. The package of claim 1 , wherein the first mold compound is selected from a group consisting of: polyimide (PI) and polybenzoxazoles (PBO).
3. The package of claim 1 , wherein the die has at least one stepped side.
4. The package of claim 1 , wherein the one or more sidewalls form one or more planes orthogonal to a plane in which the first surface lies.
5. The package of claim 1 , wherein the second mold compound is compression molded.
6. The package of claim 1 , wherein the plurality of solder units are solder balls.
7. The package of claim 1 , wherein the plurality of solder units are reflowed bumps.
8. The package of claim 1 , wherein the metallization layer is selected from a group consisting of: electroless nickel and gold plating; and copper plating.
9. The package of claim 1 , wherein the second mold compound comprises a material selected from a group consisting of: polyamides, polyimides, polyamide-imides, polyphenylene sulfide (PPS), polyether ether ketone (PEEK), and polyester fiberglass resin.
10. The package of claim 1 , wherein a perimeter of the second mold compound is the same size as a perimeter of the package.
11. A chip scale package, comprising:
a die comprising a first surface and a second surface opposite the first surface;
a first mold compound covering at least a portion of the first surface of the die and one or more sidewalls of the die;
a metallization layer coupled on the first surface of the die; and
a second mold compound covering at least a portion of the second surface of the die and one or more sidewalls of the die;
wherein the first mold compound contacts the second mold compound; and
wherein the one or more sidewalls of the die comprise one or more steps.
12. The package of claim 11 , wherein the wherein the die comprises a thickness less than 250 microns.
13. The package of claim 11 , wherein the first mold compound comprises a polymer resin.
14. The package of claim 11 , wherein the second mold compound is compression molded.
15. The package of claim 11 , wherein the one or more sidewalls are entirely covered by the first mold compound and the second mold compound.
16. The package of claim 11 , wherein a perimeter of the second surface of the die is greater than a perimeter of the first surface of the die.
17. The package of claim 11 , wherein a perimeter of the second mold compound is the same size as a perimeter of the package.