Flexible press fit pins for semiconductor packages and related methods

1. A pin for a semiconductor package, comprising:

an upper contact portion comprising a contact surface configured to mechanically and electrically couple with a pin receiver;

a lower portion comprising a single vertical stop and at least two curved legs;

a horizontal base coupled directly to the at least two curved legs and configured to be soldered to a substrate to mechanically and electrically couple the pin to the substrate; and

a gap between a bottom contact surface of the single vertical stop and the upper contact surface of the horizontal base;

wherein the single vertical stop is located between the at least two curved legs.

2. The pin of claim 1 , wherein the at least two curved legs have an S-shape.

3. The pin of claim 1 , wherein the single vertical stop is configured to stop movement of the pin when the bottom contact surface contacts the upper contact surface.

4. The pin of claim 1 , wherein the upper contact portion comprises a deformable portion configured to deform along a direction substantially perpendicular with the longest length of the pin in response to inserting the upper contact portion into the pin receiver.

5. The pin of claim 1 , wherein the pin comprises a plurality of stops extending substantially perpendicular to the longest length of the pin and configured to prevent the pin from moving relative to a casing of a semiconductor package when the pin is removed from the pin receiver.

6. The pin of claim 1 , wherein a gap is present between the curves of the at least two curved legs.

7. The pin of claim 1 , wherein each of the curves of the at least two curved legs are substantially parallel.

8. A pin for a semiconductor package, comprising:

an upper contact portion comprising a contact surface configured to mechanically and electrically couple with a pin receiver;

a lower portion bent into single N-shape comprising a first section and a second section;

a horizontal base coupled directly to the second section of the lower portion, the horizontal base configured to be soldered to a substrate to mechanically and electrically couple the pin to the substrate, the horizontal base having an upper contact surface and the horizontal base extending substantially perpendicularly beyond a width of the upper contact portion; and

a gap between a lower contact surface of the first section and the horizontal base.

9. The pin of claim 8 , wherein the first section of the single N-shape is collinear with the longest length of the pin.

10. The pin of claim 8 , wherein the second section of the single N-shape is coupled to the horizontal base through a bend comprising an angle between 60 and 120 degrees.

11. The pin of claim 8 , wherein the single N-shape is configured to flex to allow the lower contact surface to move toward the upper contact surface in response to a pressure applied to the pin along a direction collinear with a longest length of the pin toward the upper contact surface.

12. The pin of claim 8 , wherein the single N-shape is configured to stop flexing after the single N-shape has bent sufficiently to allow the lower contact surface to contact the upper contact surface.

13. The pin of claim 8 , wherein the upper contact portion comprises a deformable portion configured to deform along a direction substantially perpendicular with the longest length of the pin in response to inserting the upper contact portion into the pin receiver.

14. The pin of claim 8 , wherein the pin comprises a plurality of stops extending perpendicularly to the longest length of the pin and configured to prevent the pin from moving relative to a casing of a semiconductor package when the pin is removed from the pin receiver.

15. A pin for a semiconductor package, comprising:

an upper contact portion comprising a contact surface configured to mechanically and electrically couple with a pin receiver;

a lower portion comprising a single vertical stop and at least two curved legs, wherein the at least two curved legs comprise a first portion and a second portion;

a horizontal base coupled directly to the second portion of the at least two curved legs and configured to be soldered to a substrate to mechanically and electrically couple the pin to the substrate, the horizontal base having an upper contact surface and the horizontal base extending substantially perpendicularly beyond a width of the upper contact portion; and

a gap between a bottom contact surface of the single vertical stop and the upper contact surface of the horizontal base;

wherein the single vertical stop is located between the at least two curved legs.

16. The pin of claim 15 , wherein the first portion of each of the at least two curved legs has a C-shape.

17. The pin of claim 15 , wherein the second portion of each of the at least two curved legs is coupled to the horizontal base through a bend comprising an angle between 60 and 90 degrees.

18. The pin of claim 15 , wherein the single vertical stop is configured to stop movement of the pin when the bottom contact surface contacts the upper contact surface.

19. The pin of claim 15 , wherein the upper contact portion comprises a deformable portion configured to deform along a direction substantially perpendicular with the longest length of the pin in response to inserting the upper contact portion into the pin receiver.

20. The pin of claim 15 , wherein the pin comprises a plurality of stops extending perpendicularly to the longest length of the pin and configured to prevent the pin from moving relative to a casing of a semiconductor package when the pin is removed from the pin receiver.