Patent Application
Provisional
App. No. 62/814,366
· Confirmation No. 7877
Semiconductor Package and Related Methods
Applicant:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2019-03-13 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2019-03-06 | ADS |
Application Data Sheet | 9 | View | |
| 2019-03-06 | SPEC |
Specification | 17 | View | |
| 2019-03-06 | CLM |
Claims | 3 | View | |
| 2019-03-06 | APPENDIX |
Appendix to the specification | 29 | View | |
| 2019-03-06 | DRW |
Drawings-only black and white line drawings | 20 | View | |
| 2019-03-06 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2019-03-06 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Chee Hiong CHEW
Seremban, MALAYSIA
Erik Nino TOLENTINO
Seremban, MALAYSIA
Vemmond Jeng Hung NG
Senawang, MALAYSIA
Shutesh KRISHNAN
Seremban, MALAYSIA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 132194
- Docket No.
- ONS03207L01US
- Confirmation No.
- 7877
Child
Claims priority from a provisional application
→
App. 16/745,762
· US 11,830,856
Filed 2020-01-17
· Patented Case
Child
Claims priority from a provisional application
→
App. 19/225,939
Filed 2025-06-02
· Docketed New Case - Ready for Examination
Child
Claims priority from a provisional application
→
App. 18/490,270
· US 12,347,813
Filed 2023-10-19
· Patented Case
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 62/814,366
- Filed
- 2019-03-06
External Links