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App. No. 19/225,939 · Confirmation No. 1760

SEMICONDUCTOR PACKAGE AND RELATED METHODS

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2026-02-24 FOR Foreign Reference 8 View
2026-02-24 FOR Foreign Reference 16 View
2026-02-24 IDS Information Disclosure Statement (IDS) Form (SB08) 5 View
2026-02-24 N417 Electronic Filing System Acknowledgment Receipt 2 View
2025-09-18 NTC.PUB Notice of Publication 1 View
2025-06-13 APP.FILE.REC Filing Receipt 4 View
2025-06-13 WFEE Fee Worksheet (SB06) 1 View
2025-06-13 WELCOME.LET Welcome Letter from USPTO Director and Deputy Director 1 View
2025-06-02 DRW.SUPP Drawings-black and white line and/or other drawings — View
2025-06-02 APP.TEXT Application body structured text document — View
2025-06-02 SPEC Specification 28 View
2025-06-02 CLM Claims 5 View
2025-06-02 ABST Abstract 1 View
2025-06-02 N417.PYMT Electronic Fee Payment 2 View
2025-06-02 N417 Electronic Filing System Acknowledgment Receipt 2 View
2025-06-02 PA.. Power of Attorney 3 View
2025-06-02 DRW Drawings-only black and white line drawings 21 View
2025-06-02 ADS Application Data Sheet 10 View
2025-06-02 OATH Oath or Declaration filed 4 View
2025-06-02 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
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Quick Facts
App. No.
19/225,939
Filed
2025-06-02
Pub. No.
US20250293213A1
Art Unit
OPAP