Patent Assignment
Reel/Frame 047944/0370
Assignment of Assignor's Interest
Recorded: 2019-01-09
Pages: 10
Assignors
MAEDA, KIYOHIKO
Executed: 2018-12-18
TERASAKI, MASATO
Executed: 2018-12-18
MEGAWA, YASUHIRO
Executed: 2018-12-18
MIYAKURA, TAKAHIRO
Executed: 2018-12-18
HIRANO, AKITO
Executed: 2018-12-18
NAKAGAWA, TAKASHI
Executed: 2018-12-18
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO,, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium