IP Library › Assignment 047961/0190
Patent Assignment
Reel/Frame 047961/0190

Assignment of Assignor's Interest

Recorded: 2019-01-10 Pages: 4
Assignors
ARIFEEN, SHAMS U.
Executed: 2019-01-02
CHUN, HYUNSUK
Executed: 2018-12-27
YANG, SHENG WEI
Executed: 2018-12-27
KAWAKITA, KEIZO
Executed: 2019-01-07
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property (1)
Semiconductor Devices Having Crack-Inhibiting Structures
Application: 16/236,143 →
Publication: US 2020/0211982
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 12 to Patent Security Agreement Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048948/0677 →
Supplement No. 3 to Patent Security Agreement Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048951/0902 →
Release of Security Interest Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050724/0392 →
Release of Security Interest Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051041/0317 →