Patent Assignment
Reel/Frame 048033/0149
Assignment of Assignor's Interest
Recorded: 2019-01-16
Pages: 4
Assignor
KIM, KU YONG
Executed: 2019-01-14
Assignee
MDM INC.
(HORIM-DONG) #1-409, DAEGU MACHATRONICS&MATERIALS, INSTITUTE,32, SEONGSEOGONGDAN-RO 11-GIL, DALSEO-GU, DAEGU, 42714, KOREA, REPUBLIC OF
Covered Property
(1)
PCB Module Having Multi-Sided Heat Sink Structure And Multilayer PCB Assembly For Use In Same