Patent Assignment
Reel/Frame 048034/0362
Assignment of Assignor's Interest
Recorded: 2019-01-16
Pages: 3
Assignors
LEE, PEI-HSUAN
Executed: 2019-01-04
HUANG, YU-HSUAN
Executed: 2019-01-03
KAN, CHIA-CHIA
Executed: 2019-01-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Wafer-Level Testing Method and Test Structure Thereof