Patent Assignment
Reel/Frame 048035/0778
Assignment of Assignor's Interest
Recorded: 2019-01-16
Pages: 4
Assignor
KIM, SANG-UK
Executed: 2018-12-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same