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Patent Assignment
Reel/Frame 048045/0800

Assignment of Assignor's Interest

Recorded: 2019-01-17 Pages: 6
Assignors
LEE, YUN IL
Executed: 2018-10-22
PARK, SUNG IL
Executed: 2018-10-22
PARK, JAE HYUN
Executed: 2018-10-22
LEE, HYUNG SUK
Executed: 2018-10-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Device and Method for Fabricating the Same
Application: 16/249,298 →
Publication: US 2019/0312124