Patent Assignment
Reel/Frame 048050/0753
Assignment of Assignor's Interest
Recorded: 2019-01-17
Pages: 8
Assignors
BAI, JIE
Executed: 2016-03-18
HUANG, QIAOHONG
Executed: 2016-04-14
JIANG, HONG
Executed: 2016-04-04
KIM, YOUNSANG
Executed: 2016-03-26
Assignee
HENKEL IP & HOLDING GMBH
HENKELSTRASSE 67, DUESSELDORF, 40589, GERMANY
Covered Property
(1)
Formulations Containing Mixed Resin Systems and the Use Thereof for Wafer-Level Underfill for 3D Tsv Packages
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 17, 2019
From: TAKANO, TADASHI
To: HENKEL IP & HOLDING GMBH
Reel/Frame 048050/0806 →
Assignment of Assignor's Interest
Jan 17, 2019
From: MURATA, YOUKO; HORIGUCHI, YUSUKE
To: HENKEL JAPAN LTD.
Reel/Frame 048050/0890 →
Assignment of Assignor's Interest
Jan 17, 2019
From: HENKEL JAPAN LTD.
To: HENKEL AG & CO. KGAA
Reel/Frame 048050/0955 →
Assignment of Assignor's Interest
Mar 9, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059357/0267 →