Patent Assignment
Reel/Frame 048050/0890
Assignment of Assignor's Interest
Recorded: 2019-01-17
Pages: 5
Assignee
HENKEL JAPAN LTD.
2-2-8 HIGASHI SHINAGAWA, SHINAGAWA-KU, TOKYO, JAPAN
Covered Property
(1)
Formulations Containing Mixed Resin Systems and the Use Thereof for Wafer-Level Underfill for 3D Tsv Packages
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 17, 2019
From: BAI, JIE; HUANG, QIAOHONG; JIANG, HONG; KIM, YOUNSANG
To: HENKEL IP & HOLDING GMBH
Reel/Frame 048050/0753 →
Assignment of Assignor's Interest
Jan 17, 2019
From: TAKANO, TADASHI
To: HENKEL IP & HOLDING GMBH
Reel/Frame 048050/0806 →
Assignment of Assignor's Interest
Jan 17, 2019
From: HENKEL JAPAN LTD.
To: HENKEL AG & CO. KGAA
Reel/Frame 048050/0955 →
Assignment of Assignor's Interest
Mar 9, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059357/0267 →