Patent Assignment
Reel/Frame 048064/0666
Assignment of Assignor's Interest
Recorded: 2019-01-21
Pages: 4
Assignors
CHENG, LI-HUI
Executed: 2019-01-07
KAO, CHIN-FU
Executed: 2019-01-07
CHIEN, CHIH-YUAN
Executed: 2019-01-07
LU, SZU-WEI
Executed: 2019-01-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure Having Adhesive Layer Surrounded Dam Structure