Patent Assignment
Reel/Frame 048067/0646
Assignment of Assignor's Interest
Recorded: 2019-01-13
Pages: 3
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Electronic Device Packages and Methods for Maximizing Electrical Current to Dies and Minimizing Bond Finger Size
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.