IP Library › Assignment 048080/0935
Patent Assignment
Reel/Frame 048080/0935

Assignment of Assignor's Interest

Recorded: 2019-01-22 Pages: 3
Assignor
VIA TECHNOLOGIES, INC.
Executed: 2018-11-26
Assignee
VIA LABS, INC.
7F, 529-1, ZHONGZHENG RD., XINDIAN DIST., NEW TAIPEI CITY, 231, TAIWAN
Covered Properties (5)
Pci Express Physical Layer Built-in Self Test Architecture
Patent: 7,490,278 →
Application: 11/162,153 →
Publication: US 2006/0123298
Serial Interface Device Built-in Self Test
Patent: 8,051,350 →
Application: 12/346,800 →
Publication: US 2009/0119053
Integrated Circuits for Accessing Usb Device via Usb 3.0 Receptacle
Patent: 8,347,017 →
Application: 12/469,792 →
Publication: US 2010/0233908
Serial Interface Device Built-in Self Test
Patent: 8,234,530 →
Application: 13/110,235 →
Publication: US 2011/0225470
Integrated Circuits for Accessing Usb Device
Patent: 8,554,977 →
Application: 13/666,435 →
Publication: US 2013/0059453
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 30, 2005
From: TSENG, WAYNE
To: VIA TECHNOLOGIES INC.
Reel/Frame 016474/0039 →
Assignment of Assignor's Interest Dec 30, 2008
From: TSENG, WAYNE
To: VIA TECHNOLOGIES INC.
Reel/Frame 022042/0318 →
Assignment of Assignor's Interest May 21, 2009
From: TSENG, WEN-YU
To: VIA TECHNOLOGIES, INC.
Reel/Frame 022717/0218 →
Assignment of Assignor's Interest Nov 1, 2012
From: TSENG, WEN-YU
To: VIA TECHNOLOGIES, INC.
Reel/Frame 029226/0704 →