Patent Assignment
Reel/Frame 048093/0627
Assignment of Assignor's Interest
Recorded: 2019-01-22
Pages: 5
Assignors
CHEN, YANG-CHE
Executed: 2019-01-03
CHOU, WEI-YU
Executed: 2019-01-03
SHUE, HONG-SENG
Executed: 2019-01-03
LIN, CHEN-HUA
Executed: 2019-01-04
TSENG, HUANG-WEN
Executed: 2019-01-03
LIANG, VICTOR CHIANG
Executed: 2019-01-08
LIU, CHWEN-MING
Executed: 2019-01-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Device Having Probe Pads and Seal Ring