Patent Assignment
Reel/Frame 048100/0773
Assignment of Assignor's Interest
Recorded: 2019-01-23
Pages: 7
Assignors
BEMMERL, THOMAS
Executed: 2018-12-14
CHAN, KUOK WAI
Executed: 2019-01-04
LIEBL, CHRISTOPH
Executed: 2018-12-18
TAY, BUN KIAN
Executed: 2019-01-04
TAY, WEE BOON
Executed: 2019-01-03
YONG, WAE CHET
Executed: 2019-01-04
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Encapsulated Leadless Package Having an at Least Partially Exposed Interior Sidewall of a Chip Carrier