Patent Assignment
Reel/Frame 048106/0934
Assignment of Assignor's Interest
Recorded: 2019-01-23
Pages: 4
Assignors
LEE, KONG WENG
Executed: 2019-01-17
WONG, VINCENT V.
Executed: 2019-01-17
SKIDMORE, JAY A.
Executed: 2019-01-17
YALAMANCHILI, PRASAD
Executed: 2019-01-17
SAMADI, GITY
Executed: 2019-01-17
SRINIVASAN, RAMAN
Executed: 2019-01-18
GUAN, YONGFENG
Executed: 2019-01-17
KHASSINE, SLAVA
Executed: 2019-01-18
Assignee
LUMENTUM OPERATIONS LLC
400 NORTH MCCARTHY BLVD, MILPITAS, CALIFORNIA, 95035
Covered Properties
(2)
Emitter-On-Sub-Mount Device
Ultra-Low Stress Chip-on-Submount Leadframe Packaging Design for a Laser Device
Application:
62/629,521 →
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement
Dec 11, 2018
From: LUMENTUM OPERATIONS LLC; OCLARO FIBER OPTICS, INC.; OCLARO, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047788/0511 →
Release of Security Interest
Dec 13, 2019
From: DEUTSCHE AG NEW YORK BRANCH
To: OCLARO FIBER OPTICS, INC.; LUMENTUM OPERATIONS LLC; OCLARO, INC.
Reel/Frame 051287/0556 →