IP Library › Patent Application 62629521
Patent Application Provisional
App. No. 62/629,521 · Confirmation No. 7391

ULTRA-LOW STRESS CHIP-ON-SUBMOUNT LEADFRAME PACKAGING DESIGN FOR A LASER DEVICE

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2018-02-16 APP.FILE.REC Filing Receipt 3 View
2018-02-12 PA.. Power of Attorney 2 View
2018-02-12 SPEC Specification 4 View
2018-02-12 CLM Claims 1 View
2018-02-12 DRW Drawings-only black and white line drawings 7 View
2018-02-12 ADS Application Data Sheet 10 View
2018-02-12 WFEE Fee Worksheet (SB06) 2 View
2018-02-12 N417 Electronic Filing System Acknowledgment Receipt 3 View
2018-02-12 TRAN.LET Transmittal Letter 1 View
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Quick Facts
App. No.
62/629,521
Filed
2018-02-12