Patent Assignment
Reel/Frame 048107/0519
Assignment of Assignor's Interest
Recorded: 2019-01-23
Pages: 7
Assignors
JANG, JAE-SEOK
Executed: 2018-12-26
JANG, DONGMIN
Executed: 2018-12-26
PARK, GEUNJE
Executed: 2018-12-26
LEE, JAEKWANG
Executed: 2018-12-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Module