Patent Assignment
Reel/Frame 048138/0496
Assignment of Assignor's Interest
Recorded: 2019-01-25
Pages: 4
Assignors
LEE, PEI-WEI
Executed: 2019-01-10
HUNG, TSUNG-YU
Executed: 2019-01-10
TSAI, PANG-YEN
Executed: 2019-01-10
OKUNO, YASUTOSHI
Executed: 2019-01-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof