Patent Assignment
Reel/Frame 048142/0547
Assignment of Assignor's Interest
Recorded: 2019-01-25
Pages: 5
Assignee
SUMCO CORPORATION
2-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8634, JAPAN
Covered Property
(1)
Double-Sided Wafer Polishing Method