Assignment of Assignor's Interest

Recorded: 2019-01-26 Pages: 6

Assignors

RABIEI, PAYAM

Executed: 2019-01-26

NAM, JAMIE

Executed: 2019-01-26

TORKAMAN, AMIR

Executed: 2019-01-26

TOROGHI, SEYFOLLAH

Executed: 2019-01-26

Assignee

PARTOW TECHNOLOGIES LLC

1487 POINSETTIA AVE., VISTA, CALIFORNIA, 92081

Covered Property (1)

Apparatus For Bonding Wafers and an Optically-Transparent Thin Film Made from the Same

Patent: 10,663,661 →

Application: 16/258,546 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.