Patent Assignment
Reel/Frame 048146/0276
Assignment of Assignor's Interest
Recorded: 2019-01-27
Pages: 5
Assignors
HSIAO, MIN-CHIEN
Executed: 2019-01-21
WANG, CHUEI-TANG
Executed: 2019-01-21
SHIH, CHAO-WEN
Executed: 2019-01-21
PU, HAN-PING
Executed: 2019-01-21
CHEN, CHIEH-YEN
Executed: 2019-01-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure and Manufacturing Method Thereof