Patent Assignment
Reel/Frame 048152/0451
Assignment of Assignor's Interest
Recorded: 2019-01-28
Pages: 5
Assignors
LIN, CHIH-HAO
Executed: 2018-10-18
CHANG, CHIEN-KUO
Executed: 2018-10-18
LAN, TZU-KAI
Executed: 2018-10-18
CHEN, CHUNG-CHIH
Executed: 2018-10-18
HSU, JR-LIN
Executed: 2019-01-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package Having Varying Conductive Pad Sizes