Patent Assignment
Reel/Frame 048159/0166
Assignment of Assignor's Interest
Recorded: 2019-01-28
Pages: 2
Assignor
LIU, HSIANG-WEI
Executed: 2019-01-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure and Method for Forming the Same