Patent Assignment
Reel/Frame 048161/0856
Assignment of Assignor's Interest
Recorded: 2019-01-29
Pages: 6
Assignors
CHEN, WEI-YU
Executed: 2019-01-17
SU, AN-JHIH
Executed: 2019-01-17
YEH, DER-CHYANG
Executed: 2019-01-21
TSENG, HUA-WEI
Executed: 2019-01-17
HUANG, LI-HSIEN
Executed: 2019-01-17
YEH, MING-SHIH
Executed: 2019-01-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure, Die and Method of Manufacturing the Same