IP Library › Assignment 048191/0161
Patent Assignment
Reel/Frame 048191/0161

Assignment of Assignor's Interest

Recorded: 2019-01-30 Pages: 8
Assignors
SUGIMOTO, SATORU
Executed: 2019-01-29
HOSAKA, HIROKI
Executed: 2019-01-29
OISHI, HAYATO
Executed: 2019-01-29
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1-525, BOISE, IDAHO, 83716
Covered Property (1)
Integrated Assemblies Having Capacitive Units, and Having Resistive Structures Coupled with the Capacitive Units
Application: 16/262,087 →
Publication: US 2020/0243501
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 12 to Patent Security Agreement Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048948/0677 →
Supplement No. 3 to Patent Security Agreement Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048951/0902 →
Release of Security Interest Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050724/0392 →
Release of Security Interest Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051041/0317 →