Patent Assignment
Reel/Frame 048191/0845
Assignment of Assignor's Interest
Recorded: 2019-01-30
Pages: 3
Assignors
SUN, HUNG-CHANG
Executed: 2019-01-02
MINEJI, AKIRA
Executed: 2019-01-02
FANG, ZIWEI
Executed: 2019-01-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure with Air Gap and Method Sealing the Air Gap