Patent Assignment
Reel/Frame 048198/0094
Assignment of Assignor's Interest
Recorded: 2019-01-31
Pages: 4
Assignors
HSU, SEN-KUEI
Executed: 2019-01-25
PAN, HSIN-YU
Executed: 2019-01-25
CHIANG, YI-CHE
Executed: 2019-01-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Device, Package Structure and Method of Fabricating the Same