Patent Assignment
Reel/Frame 048230/0448
Assignment of Assignor's Interest
Recorded: 2019-02-04
Pages: 4
Assignors
PAN, KUO LUNG
Executed: 2019-01-23
CHUN, SHU-RONG
Executed: 2019-01-23
LO, TENG-YUAN
Executed: 2019-01-23
KUO, HUNG-YI
Executed: 2019-01-23
CHANG, CHIH-HORNG
Executed: 2019-01-24
KUO, TIN-HAO
Executed: 2019-01-23
TSAI, HAO-YI
Executed: 2019-01-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method