Patent Assignment
Reel/Frame 048241/0009
Assignment of Assignor's Interest
Recorded: 2019-02-05
Pages: 5
Assignors
SON, SOO HWAN
Executed: 2016-02-02
RA, SEUNG HYUN
Executed: 2016-02-02
JUN, KYOUNG JIN
Executed: 2016-02-02
PARK, SANG SOO
Executed: 2016-02-02
KIM, YOUNG KEY
Executed: 2016-02-24
LEE, SOON JU
Executed: 2016-02-24
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Laminated Electronic Component and Circuit Board for Mounting the Same