Patent Assignment
Reel/Frame 048250/0553
Assignment of Assignor's Interest
Recorded: 2019-02-06
Pages: 6
Assignors
YANG, YI
Executed: 2018-12-14
SUNDAR, VIGNESH
Executed: 2018-12-14
SHEN, DONGNA
Executed: 2018-12-14
PATEL, SAHIL
Executed: 2018-12-14
TONG, RU-YING
Executed: 2018-12-14
WANG, YU-JEN
Executed: 2018-12-14
Assignee
HEADWAY TECHNOLOGIES, INC.
678 S. HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Method to Integrate MRAM Devices to the Interconnects of 30nm and Beyond CMOS Technologies