Patent Assignment
Reel/Frame 048253/0329
Assignment of Assignor's Interest
Recorded: 2019-02-06
Pages: 4
Assignor
YE, GUOLIANG
Executed: 2018-11-30
Assignee
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 18 GAOXIN 4TH ROAD, DONGHU DEVELOPMENT ZONE, WUHAN, HUBEI, 430205, CHINA
Covered Property
(1)
Multi-Wafer Bonding Structure and Bonding Method