IP Library Assignment 048254/0043
Patent Assignment
Reel/Frame 048254/0043

Assignment of Assignor's Interest

Recorded: 2019-02-06 Pages: 3
Assignors
BAE, SUNG HAWN
Executed: 2019-01-24
KIM, JUNG SOO
Executed: 2019-01-24
CHOI, WON
Executed: 2019-01-24
KIM, SUNG HOAN
Executed: 2019-01-24
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Fan-Out Semiconductor Package
Application: 16/268,874 →
Publication: US 2020/0051918
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →