IP Library › Assignment 048281/0762
Patent Assignment
Reel/Frame 048281/0762

Assignment of Assignor's Interest

Recorded: 2019-02-08 Pages: 9
Assignor
SUNEDISON SEMICONDUCTOR LIMITED
Executed: 2018-06-06
Assignee
GLOBALWAFERS CO., LTD.
NO. 8. INDUSTRIAL ROAD 2,, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property (1)
Liner Assemblies for Substrate Processing Systems
Application: 16/235,671 →
Publication: US 2019/0136375
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 8, 2019
From: ABEDIJABERI, ARASH; THOMAS, SHAWN
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 048281/0597 →
Assignment of Assignor's Interest Feb 8, 2019
From: MEMC ELECTRONIC MATERIALS, INC.
To: SUNEDISON SEMICONDUCTOR LIMITED
Reel/Frame 048281/0683 →