Patent Assignment
Reel/Frame 048293/0315
Assignment of Assignor's Interest
Recorded: 2019-02-11
Pages: 4
Assignors
VADHAVKAR, SAMEER S.
Executed: 2015-02-18
LI, XIAO
Executed: 2015-02-18
CHANDOLU, ANILKUMAR
Executed: 2015-02-18
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Property
(1)
Apparatuses and Methods for Semiconductor Die Heat Dissipation
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 12 to Patent Security Agreement
Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048948/0677 →
Supplement No. 3 to Patent Security Agreement
Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048951/0902 →
Release of Security Interest
Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050724/0392 →
Release of Security Interest
Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051041/0317 →