Patent Assignment
Reel/Frame 048312/0501
Assignment of Assignor's Interest
Recorded: 2019-02-12
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2019-01-29
KUO, TIN-HAO
Executed: 2019-01-25
TSAI, HAO-YI
Executed: 2019-01-25
LIU, CHUNG-SHI
Executed: 2019-01-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Dummy Dies for Reducing Warpage in Packages