Patent Assignment
Reel/Frame 048317/0091
Assignment of Assignor's Interest
Recorded: 2019-02-13
Pages: 5
Assignors
KOBUKE, HISASHI
Executed: 2018-07-20
SOTOMA, NAOKI
Executed: 2018-07-20
FUTAMATA, YOUSUKE
Executed: 2018-07-17
NINOMIYA, EMI
Executed: 2018-07-17
ISHIMOTO, ATUSHI
Executed: 2018-07-20
Assignee
TDK CORPORATION
3-9-1 SHIBAURA, MINATO-KU, TOKYO, 108-0023, JAPAN
Covered Property
(1)
Multilayer Interconnection Substrate for High Frequency and Manufacturing Method Thereof
Application:
16/086,333 →
Publication:
US 2019/0089044
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 20, 2018
From: TDK CORPORATION; TDK ELECTRONICS AG
To: SNAPTRACK, INC.
Reel/Frame 047553/0476 →
Assignment of Assignor's Interest
Feb 13, 2019
From: TDK CORPORATION
To: QUALCOMM INCORPORATED; SNAPTRACK, INC.
Reel/Frame 048317/0171 →
Assignment of Assignor's Interest
Feb 13, 2019
From: EPCOS AG
To: SNAPTRACK, INC.
Reel/Frame 048317/0234 →
Corrective Assignment to Correct the Delete Qualcomm Incorporated from Receiving Party Previously Recorded at Reel: 48317 Frame: 171. Assignor(S) Hereby Confirms the Assignment.
Mar 19, 2019
From: TDK CORPORATION; TDK ELECTRONICS AG
To: SNAPTRACK, INC.
Reel/Frame 050701/0068 →
Corrective Assignment to Correct the the Last Inventor Name Previously Recorded at Reel: 48317 Frame: 091. Assignor(S) Hereby Confirms the Assignment.
Mar 19, 2019
From: KOBUKE, HISASHI; SOTOMA, NAOKI; FUTAMATA, YOUSUKE; NINOMIYA, EMI
To: TDK CORPORATION
Reel/Frame 048636/0720 →