Patent Assignment
Reel/Frame 048318/0564
Assignment of Assignor's Interest
Recorded: 2019-02-13
Pages: 4
Assignors
BAO, JUNJING
Executed: 2019-02-12
DENG, JIE
Executed: 2019-02-12
ZHU, JOHN
Executed: 2019-02-12
NALLAPATI, GIRIDHAR
Executed: 2019-02-12
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Structure and Method of Metal Wraparound for Low via Resistance