Patent Assignment
Reel/Frame 048320/0200
Assignment of Assignor's Interest
Recorded: 2019-02-13
Pages: 3
Assignors
RAMANATHAN, PRASAD
Executed: 2019-01-22
NEAL, NICHOLAS
Executed: 2019-01-24
JHA, CHANDRA MOHAN
Executed: 2019-01-22
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Thermal Bump Networks for Integrated Circuit Device Assemblies