Patent Assignment
Reel/Frame 048343/0580
Assignment of Assignor's Interest
Recorded: 2019-02-15
Pages: 6
Assignors
KIM, JUN-HYUNG
Executed: 2018-11-29
KIM, SUNG-HYUP
Executed: 2018-11-30
KIM, TAE-YEONG
Executed: 2018-11-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Bonding Apparatus and Wafer Bonding System Using the Same