Patent Assignment
Reel/Frame 048347/0826
Assignment of Assignor's Interest
Recorded: 2019-02-15
Pages: 3
Assignors
LEE, JIN-YUAN
Executed: 2001-01-28
LIN, MOU-SHIUNG
Executed: 2001-01-28
HUANG, CHING-CHENG
Executed: 2001-01-28
Assignee
MEGIC CORPORATION
21, R & D FIRST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Low Fabrication Cost, Fine Pitch and High Reliability Solder Bump
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →
Assignment of Assignor's Interest
Feb 15, 2019
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 048347/0953 →