Patent Assignment
Reel/Frame 048347/0953
Assignment of Assignor's Interest
Recorded: 2019-02-15
Pages: 5
Assignor
MEGIC CORPORATION
Executed: 2006-04-28
Assignee
MEGICA CORPORATION
NO. 47, PARK 2ND RD. SCIENCE-BASED INDUSTRIAL PARK, ROOM 301/302, HSINCHU, TAIWAN
Covered Property
(1)
Low Fabrication Cost, Fine Pitch and High Reliability Solder Bump
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →
Assignment of Assignor's Interest
Feb 15, 2019
From: LEE, JIN-YUAN; LIN, MOU-SHIUNG; HUANG, CHING-CHENG
To: MEGIC CORPORATION
Reel/Frame 048347/0826 →