Patent Assignment
Reel/Frame 048360/0443
Assignment of Assignor's Interest
Recorded: 2019-02-18
Pages: 2
Assignors
HU, CHIH-CHIA
Executed: 2019-01-30
JAN, SEN-BOR
Executed: 2019-01-30
CHEN, HSIEN-WEI
Executed: 2019-01-30
CHEN, MING-FA
Executed: 2019-01-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Manufacture