IP Library › Assignment 048368/0200
Patent Assignment
Reel/Frame 048368/0200

Assignment of Assignor's Interest

Recorded: 2019-02-19 Pages: 6
Assignors
LEE, KOK HOE
Executed: 2019-02-11
BANDHU, SAUJIT
Executed: 2019-02-11
QIAO, YUNLONG
Executed: 2019-02-11
VITTAPALLI, RAO L.
Executed: 2019-02-07
Assignee
3M INNOVATIVE PROPERTIES COMPANY
P.O. BOX 33427, SAINT PAUL, MINNESOTA, 55133-3427
Covered Property (1)
Connector Assembly for Solderless Mounting to a Circuit Board
Application: 16/326,457 →
Publication: US 2021/0296804